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| Parameters | Copper and Silver Ionisation | Continuous Chlorination | Heat and Flush | Chlorine Dioxide | Ultra Violet Light (U.V.) |
| Concentration required at outlets | Cu = 0.2 - 0.8 mg/l |
2 - 4 mg/l as free chlorine | 80°C for 30 min | 0.5 - 1 mg/l as CLO2 | 300 nm |
| On-site efficacy documented in literature | Yes | Yes | Yes | Yes | Yes |
| Residual effect | Yes | No | No | More stable than Chlorine | No |
| Time to re-colonization | 6 - 12 weeks | 1 - 2 weeks | Varies | No information available | Only works at point of entry |
| Temperature | Residuals uneffected by high temperature | Residuals decrease as temperature increases | NA | Residuals decrease as temperature increases | Only works at point of entry |
| pH | Elevated pH (>8.5) may affect efficacy | Elevated pH (>8.5) affect efficacy | No effect | No effect | No effect |
| Disinfection by-product | None known | Trihalomethane (THMs) | None | Chlorate and Chlorite | None |
| Taste and odors | None | Yes | No | Minimal at high concentrations | None |
| Pipe corrosion | Non observed | Highly corrosive | Old pipe may be affected | Corrosive | None |
| Maintenance issues | Routine ion monitoring Routine inspection of electrodes |
COSHH Applies Concentration control and monitoring Corrosion control |
Scalding possible Labour intensive |
COSHH Applies Concentration control and monitoring Corrosion control |
Routine cleaning |
| Efficacy issues | None | Does not penetrate biofilm Loses efficacy at elevated pH. Decays at elevated temperature and over distance |
Does not penetrate biofilm Legionella bacteria only lay dormant below 20°C and above 60°C |
Decays at elevated temperature and over distance | Can only be effective at point of entry Does not work with shadows |